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## CS704 – Advanced Computer Architecture-II

In CS704 Advanced Computer Architecture-II we have you covered with Digitized Past Papers From Fall of Mid Term and Final Term.

FINAL TERM
MID TERM

# 1 Comment

1. Long Questions:
Q.1.Find the die yield for a processor chip with the following manufacturing cost factors: die size = 380 mm
2
, estimated defect rate = 0.75 per cm
2
, α = 4 (5)
Solutions:
Die yield is the fraction or percentage of good dies on a wafer number • Wafer yield accounts for completely bad wafers so need not be tested
• Wafer yield corresponds to on defect density by α which depends on
• Good estimate for CMOS is 4.0 and
• Die yield = Wafer yield x (1 + defects per unit area x die area)/ α) –α
• Example: The yield of a die, 0.7cm on a side, with defect density of 0.6/cm
2 = (1+[0.6×0.47]/4.0) -4 = 0.75
Die yield = Wafer yield x (1 + defects per unit area x die area / α) ) –α
Example: The yield of a die, 0.7cm on a side, with defect density of 0.75/cm
2
So, = (1+[0.75 x 380]/4.0) -4 = (1+285 / 4 ) -4
(71.5) -4 = 1
/ (71.5 ) 4 = 0.00349
Q.2. If computer A runs a programs in 5seconds and computer B runs the same program in 10 seconds, how much
slower is B than A? RR=3 (5)
Q.4. Briefly define the following terms: (10)
Pipelining:
A technique used in advanced microprocessors where the microprocessor begins executing a
second instruction before the first has been completed. That is, several instructions are in the
pipeline simultaneously, each at a different processing stage.
The pipeline is divided into segments and each segment can execute its operation concurrently with the other
segments. When a segment completes an operation, it passes the result to the next segment in the pipeline and
fetches the next operation from the preceding segment. The final results of each instruction emerge at the end of
the pipeline in rapid succession.

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